Tin-Silver-Copper Alloy Powder
Application
Apply to manufacture solder paste.
Product Features
1. Uniform particle size
2. Spherical shape
3. Good dispersion property
4. Low Oxygen content
Product specification
|
Specification
|
Mean Particle Size
(μm)
|
Melting Point
（℃）
|
Alloying Component
（wt%）
|
|
SAC0305-GB1500
|
1-2μm
|
224-226
|
Sn-0.3Ag-0.5Cu
|
|
SAC0307-GB1500
|
1-2μm
|
217-219
|
Sn-3.0Ag-0.7Cu
|
Different specifications products can be customized.
