Product Description

Tin-Silver-Copper Alloy Powder

 

 

 

Application

Apply to manufacture solder paste.

 

Product Features

1. Uniform particle size

2. Spherical shape

3. Good dispersion property

4. Low Oxygen content

 

Product specification

Specification	Mean Particle Size (μm)	Melting Point （℃）	Alloying Component （wt%）
SAC0305-GB1500	1-2μm	224-226	Sn-0.3Ag-0.5Cu
SAC0307-GB1500	1-2μm	217-219	Sn-3.0Ag-0.7Cu

 

Different specifications products can be customized.

Payment Terms︰ TT/LC

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