Silver Powder
Application
Apply to manufacture the sintering thick-film conductor pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.
Products Features
1. Good dispersion property
- Low shrinkage
- High crystallinity
- Good electric conductivity
- Good filling property
Product specification
|
Specification
|
Mean Particle Size
(μm)
|
Specific Surface Area
(m2/g)
|
Particle Size Distribution
(μm)
|
Tap Density
(g/cm3)
|
|
D10
|
D50
|
D90
|
|
Ag-GB0400
|
0.38-0.46
|
1.25-1.50
|
0.17-0.31
|
0.48-0.67
|
0.90-1.16
|
≥4.2
|
|
Ag-GB0800
|
0.73-0.92
|
0.62-0.78
|
0.55-0.88
|
0.88-1.45
|
1.52-2.94
|
≥4.6
|
|
Ag-GB1000
|
0.95-1.15
|
0.50-0.60
|
0.65-0.85
|
1.24-1.53
|
2.27-3.05
|
≥4.8
|
|
Ag-GB1500
|
1.27-1.73
|
0.33-0.45
|
0.95-1.35
|
1.82-2.43
|
3.60-4.70
|
≥5.0
|
|
Ag-GB2000
|
1.79-2.29
|
0.25-0.32
|
1.30-1.82
|
2.40-3.40
|
4.20-6.20
|
≥5.2
|
|
AgF-GB0800
|
-
|
1.30-1.50
|
0.30-0.60
|
0.65-0.95
|
1.30-1.50
|
≥3.3
|
|
AgF-GB2000
|
-
|
0.80-0.90
|
1.00-1.30
|
1.80-2.30
|
3.50-5.00
|
≥4.0
|
Products customized available.
