Cu-Mn Alloy Powder
Applications
Substituting Ag or Ag-Pd powder for the electrode paste/slurry in the field of chip resistor.
Product Features
1. Spherical shape
- Narrow size distribution
- Homogeneous alloying elements distribution
- Excellent anti-oxidation
Product specification
|
Specification
|
MeanParticle Size
(μm)
|
Specific Surface Area
(m2/g)
|
Mn content
(wt.%)
|
O content
(ppm)
|
|
CuMn-GB1015
|
1.00
|
1.20-1.60
|
15±1
|
≤6000
|
|
CuMn-GB1025
|
1.00
|
1.20-1.60
|
25±1
|
≤8000
|
|
CuMn-GB2015
|
2.00
|
0.50-1.00
|
15±1
|
≤6000
|
|
CuMn-GB2025
|
2.00
|
0.50-1.00
|
25±1
|
≤8000
|
Products customized available.
