Product Description

Cu-Mn Alloy Powder

 

 

Applications

Substituting Ag or Ag-Pd powder for the electrode paste/slurry in the field of chip resistor.

 

 

Product Features

1. Spherical shape

• Narrow size distribution
• Homogeneous alloying elements distribution
• Excellent anti-oxidation

 

 

Product specification

Specification	MeanParticle Size (μm)	Specific Surface Area (m2/g)	Mn content (wt.%)	O content (ppm)
CuMn-GB1015	1.00	1.20-1.60	15±1	≤6000
CuMn-GB1025	1.00	1.20-1.60	25±1	≤8000
CuMn-GB2015	2.00	0.50-1.00	15±1	≤6000
CuMn-GB2025	2.00	0.50-1.00	25±1	≤8000

 

 

Products customized available.

Payment Terms︰ TT/LC

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