Silver Sphere or Flake Powder
Application
Apply to manufacture the sintering thick-film conductor pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.
Products Features
1. Good dispersion property
2. Low shrinkage
3. High crystallinity
4. Good electric conductivity
5. Good filling property
Product specification
|
Specification
|
Mean Particle Size
(μm)
|
Specific Surface Area
(m2/g)
|
Particle Size Distribution
(μm)
|
Tap Density
(g/cm3)
|
|
D10
|
D50
|
D90
|
|
Ag-GB0400
|
0.38-0.46
|
1.25-1.50
|
0.17-0.31
|
0.48-0.67
|
0.90-1.16
|
≥4.2
|
|
Ag-GB0800
|
0.73-0.92
|
0.62-0.78
|
0.55-0.88
|
0.88-1.45
|
1.52-2.94
|
≥4.6
|
|
Ag-GB1000
|
0.95-1.15
|
0.50-0.60
|
0.65-0.85
|
1.24-1.53
|
2.27-3.05
|
≥4.8
|
|
Ag-GB1500
|
1.27-1.73
|
0.33-0.45
|
0.95-1.35
|
1.82-2.43
|
3.60-4.70
|
≥5.0
|
|
Ag-GB2000
|
1.79-2.29
|
0.25-0.32
|
1.30-1.82
|
2.40-3.40
|
4.20-6.20
|
≥5.2
|
|
AgF-GB0800
|
-
|
1.30-1.50
|
0.30-0.60
|
0.65-0.95
|
1.30-1.50
|
≥3.3
|
|
AgF-GB2000
|
-
|
0.80-0.90
|
1.00-1.30
|
1.80-2.30
|
3.50-5.00
|
≥4.0
|
Products customized available.
