Sliver-coated Copper powder
Application
Apply to manufacture conducting paste, conducting printing ink, conducting resin, membrane switch and other intermediate and low-temperature paste, which can be instead of silver powder used in electronic industry.
Product Features
1. Uniform particle size
- Good dispersion property
- Good oxidation resistance
- Good electric conductivity
Product specification
|
Specification
|
Mean Particle Size
(μm)
|
Specific Surface Area
(m2/g)
|
Particle Size Distribution
(μm)
|
Ag Content
(wt%)
|
|
D10
|
D50
|
D90
|
|
CuAg-GB0500
|
0.5
|
1.05-1.70
|
0.80-1.80
|
15-30
|
2.80-3.30
|
15-30
|
|
CuAg-GB1000
|
1.0
|
0.90-1.10
|
2.10-2.60
|
10-30
|
5.20-5.80
|
10-30
|
|
CuAg-GB5000
|
5.0
|
0.25-0.30
|
3.30-3.80
|
10-20
|
8.80-10.30
|
10-20
|
|
CuAgF-GB0500
|
-
|
1.90-2.00
|
1.50-1.70
|
15-30
|
5.00-5.60
|
15-30
|
|
CuAgF-GB1000
|
-
|
0.80-0.95
|
2.50-3.20
|
10-30
|
5.80-6.30
|
10-30
|
|
CuAgF-GB5000
|
-
|
0.35-0.60
|
3.20-3.80
|
10-20
|
8.80-10.30
|
10-20
|
Different specifications products can be customized.
