Product Description

Sliver-coated Copper powder

 

 

Application 

Apply to manufacture conducting paste, conducting printing ink, conducting resin, membrane switch and other intermediate and low-temperature paste, which can be instead of silver powder used in electronic industry.

 

 

Product Features

1. Uniform particle size

• Good dispersion property
• Good oxidation resistance
• Good electric conductivity

 

 

 Product specification

Specification	Mean Particle Size (μm)	Specific Surface Area (m2/g)	Particle Size Distribution (μm)			Ag Content (wt%)
			D10	D50	D90
CuAg-GB0500	0.5	1.05-1.70	0.80-1.80	15-30	2.80-3.30	15-30
CuAg-GB1000	1.0	0.90-1.10	2.10-2.60	10-30	5.20-5.80	10-30
CuAg-GB5000	5.0	0.25-0.30	3.30-3.80	10-20	8.80-10.30	10-20
CuAgF-GB0500	-	1.90-2.00	1.50-1.70	15-30	5.00-5.60	15-30
CuAgF-GB1000	-	0.80-0.95	2.50-3.20	10-30	5.80-6.30	10-30
CuAgF-GB5000	-	0.35-0.60	3.20-3.80	10-20	8.80-10.30	10-20

 

 

Different specifications products can be customized.

Payment Terms︰ TT/LC

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